Etching: The exposed areas of the photoresist are removed using chemical etchants, leaving behind the desired pattern in the underlying material.

Ion Implantation: Dopants (impurities) are introduced into the semiconductor material using ion implantation technology to modify its electrical properties.

Annealing: The wafer is heated to a high temperature to activate the dopants and improve the overall performance of the device.

Metallization: Metal interconnects, also known as wires, are added to connect different components within the semiconductor. This step involves depositing metal layers, etching them into desired patterns, and applying insulating layers between them.