The thinness of silicon wafers is important because it reduces resistance and power loss. Current-gen wafers measure 40 to 60 micrometers thick. By roughly halving the wafer's thickness, Infineon has managed to slash substrate resistance by 50 percent. This, in turn, leads to over 15 percent less power loss compared to other solutions.

These benefits are particularly useful for powering the high-performance AI processors in data center servers. Such chips require voltages to be stepped down from 230V AC to under 1.8V DC, a feat achieved by Infineon's breakthrough technologies, including vertical power delivery.